Visual Components has launched Visual Components 5.0, a major update to its 3D manufacturing simulation and robot offline programming software platform. The new version introduces faster simulation ...

Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee estimates, to provide glass substrates for between 2 million and 3 million ...

The acquisition of ATIP aims to expand Weber's integrated labeling, coding, and thermal inkjet printing capabilities across multiple packaging markets in North America.

IDTechEx report says the bots are increasingly viewed as a practical route to bring artificial intelligence into ...

How new equipment and methodologies are improving reliability, yield, and time-to-market for multi-die assemblies.

Fraunhofer is developing the gammaSTAR software platform and SpinIt project to accelerate the transfer of innovative MRI technologies into clinical routine use. The vendor-neutral gammaSTAR platform ...

Fraunhofer researchers are developing an adhesive-free sealing technology for paper packaging through the PAPURE project, enabling fully recyclable packaging without plastic coatings or adhesives. The ...

ASML (ASML) plans to expand its chipmaking equipment portfolio with new products to capture more of the growing market for AI chips.

New white paper available, Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems ...

Applied Materials AMAT expects its leading-edge foundry, logic, DRAM and high-bandwidth memory (HBM) to be the fastest-growing wafer fabrication equipment businesses in 2026. In Logic, AMAT’s revenues ...

Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor assembly ...