I WAS much interested to see Mr. A. A. Campbell Swinton's letter to NATURE of February 24, p. 828, on the above subject. So far as I am aware, the first suggestion to attain low temperatures by means ...
Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
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