Polish embedded systems company Grinn has recently introduced ReneSOM-V2H, a tiny vision AI SoM built around the Renesas RZ/V2H vision AI processor.
Vision Components is presenting its VCSBC EvoCam at Embedded World 2026. For use in smart devices and industrial applications, it runs on the MediaTek Genio 510 processor.
BeagleY‑AI from BeagleBoard couples a quad‑core Arm® Cortex®‑A53 with dual C7x DSP AI accelerators (4 TOPS combined), a 50 GFLOP GPU, and modern I/O.
The jointly developed camera family transmits QHD video over unshielded twisted pair (UTP) or low-cost coaxial links, enabled by Valens’ VA7000 A-PHY devices.
At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail ...
Multi-camera vision programs often stall on integration friction such as rugged cabling, reliable synchronization, and the ...
MIPI UniPro v3.0 and M-PHY v6.0 accelerate JEDEC UFS performance for edge AI in mobile, PC and automotive, and enable twice the previous data rate and gains in efficiency and scalability for flash ...
Digital Camera World on MSN
I tried Tecno’s new modula camera phone concept and I think it could be the future
Tecno’s new modular phone concept pairs a super-thin base phone with a range of magnetically attachable camera modules ...
Last year at the MWC, we got some hands-on time with a curious prototype – the Xiaomi Modular Optical System. Xiaomi described it as a research project, so its future was uncertain. However, Digital ...
Xiaomi's latest flagship phone, unveiled at MWC 2026, leans on Leica's brand and an advanced camera grip accessory to stand ...
Teledyne FLIR OEM introduces the Lepton XDS, a compact dual thermal-visible camera module featuring MSX technology and Prism ISP.
In stock at authorised distributor Mouser Electronics are the new RA8D2 microcontrollers (MCUs) from Renesas Electronics.
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