Navitas Semiconductor (NVTS) stock jumps 18% on new AI data center power packages boosting cooling and efficiency.

GOWIN Semiconductor has launched its next-generation Arora GW1AN and GW3A field-programmable gate array (FPGA) families, ...

Engineering is powered by co-pilot. We can harmonize, contextualize, and orchestrate shop floor to top-floor data. Optimize resource usage and increase asset lifetimes ...

Navitas Semiconductor has announced the launch of two new packages: top-side cooled QDPAK and a low-profile TO-247-4L with asymmetrical leads in its 5th generation GeneSiC technology platform.

Mastercard IncorporatedMA is ramping up its efforts in the world of artificial intelligence with the introduction of Virtual C-Suite, a cutting-edge AI framework designed to provide small businesses ...

At embedded world 2026, on the DigiKey booth, Paige Hookway speaks with Mike Engelhardt, Founder at QSPICE about an introduction to QSPICE and a look at recent updates.

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a collaboration with Jabil ...

Renesas 365 directly addresses such challenges by connecting previously isolated tools such as embedded software files, datasheets and application notes into a streamlined, cloud-managed platform.

Thermal integration : Designed for easier system-level thermal integration via top-side cooling.

A new technical paper, “An Integrated Failure and Threat Mode and Effect Analysis (FTMEA) Framework with Quantified Cross-Domain Correlation Factors for Automotive Semiconductors,” was published by ...

As companies like OpenAI and Anthropic push the limits of model scale, AI chip startup dMatrix says the next phase of the ...