Tiny electronic devices, called microelectronics, may one day be printed as easily as words on a page, thanks to new research from scientists at the U.S. Department of Energy's (DOE) Argonne National ...

Engineers leverage both device-specific and tool-level data to identify a process “sweet spot.” Tight, frequent tool-to-tool matching enables greater yield and fab flexibility. Machine learning helps ...

Cornell researchers have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance. The imaging method, which was ...

At its Synopsys Converge event currently underway in Santa Clara, the company announced an array of tools and initiatives to ...

Digital twin technology is drawing significant attention across the chip industry, even though it’s still unclear who will own or manage them, what the optimal levels of abstrac ...

It can handle the added heat better than existing substrates, and it will let engineers keep shrinking chip packages—which will make them faster and more energy efficient. It “unlocks the ability to ...

Researchers at the University of Sydney have built a photonic AI chip that processes neural network tasks at the speed of light while generating far less heat and consuming far less power than ...

That drawer full of old USB drives may look useful, but think twice before reusing them, as some tasks become far riskier ...

Future devices will continue to probe the frontier of the very small, and at scales where functionality depends on mere atoms ...

We all have a concept of reality. We know what is “fact” and what isn’t. However, the truth of the matter is that the definition of “real” is a mere construct of the brain. If that didn’t blow your ...

The plant, built with an investment of Rs 22,516 crore under the National Semiconductor Mission, is India's first large-scale facility dedicated to assembling and packaging advanced memory chips used ...

A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...