Business Wire

Hprobe Announces New Generation of Magnetic Test Head for Wafer Sort of MRAM in Mass Production

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
Electronic Design

Reducing Logic Device Test Costs

Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...
Digi Times

ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
Electronic Design

Design for Test Tools Address Stacked Dies

The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...
EDN

Contactless Testing Wafer Testing

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...