A new research paper titled “ToSHI – Towards Secure Heterogeneous Integration: Security Risks, Threat Assessment, and Assurance” was published by researchers at the Florida Institute for Cybersecurity ...
It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...
3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...
Scientists in NEXT Lab, Tsinghua University have revealed the fabrication and engineering techniques of TMDs and provided a comparative view between TMDs and traditional semiconductors, demonstrating ...
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...
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