Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...

Placement of regulators for core voltage levels closer to the chips that need them Usage of unique materials like ECMs in PCBs and packages to provide power rail capacitance Package-level and ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

The 1st International Electronics, Packaging, Design & Manufacturing Conference EPDMC 2026 concluded today at Manav Rachna Intern ...