The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

On the surface, electrical testing and measurement is all about numbers. It’s a straightforward process of gathering data that, when properly collected and analyzed, reveals essential information ...

The areas of semiconductor test, inspection, and related technologies have seen considerable innovation during the second half of 2017. With regard to test, traditional ATE companies introducing new ...