http://www.coolinnovations.comWhile today's high-end ICs offer exceptional processing capabilities, they also generate heavy loads of heat. Providing adequate cooling ...

Using PIM for the manufacture of heat sinks instead of extrusion or machining broadens geometry options and creates a dense structure. Figure 1. A plot of thermal conductivity vs. thermal expansion ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

A line of hybrid pin-fin heat sinks are made from an array of forged aluminum pin-fin heat sinks that are reflowed onto a copper plate. The hybrid pin fins are available in a wide array of standard ...