Thermal engineering research has increasingly focused on innovative system design and optimization to address global challenges in energy efficiency, ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leadin ...
Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...
Kaynes Semicon Pvt. Ltd., a flagship OSAT initiative of Kaynes Technology India Ltd., today announced its strategic adoption of Synopsys' engineering simulation software through the Ansys Channel ...
Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...
It's no secret that the automotive industry's priorities are a moving target, influenced by major players as well as rapidly changing customer preferences. Emerging submarkets like software-defined ...
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