Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
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